Packaging Engineering Director: High-Speed Interconnects

SiMa.ai is seeking a Technical Director of Packaging Engineering in San Jose, CA to drive high‑performance FCBGA and SiP packaging from definition to mass production. This hands‑on leadership role requires owning SI/PI for LPDDR5x/6, PCIe Gen5, and related interfaces, while coordinating OSAT and substrate suppliers and leading a small, high‑impact team.

You will work closely with Design, Hardware and QA teams, ensuring robust thermo‑mechanical, reliability, and cost constraints are met, with